ECHO VS™-美国SONIX超声显微镜 ECHO VS™-似空科学仪器（上海）有限公司手机版

产品简介

简要描述：SONIX 公司是世界500强丹纳赫集团(NYSE: DHR)下的全资子公司，是超声波扫描检测仪和无损检测设备的制造商。自1986年成立以来，SONIX 在无损检测领域中不断改革创新，是基于微机平台，提供全数字化成像方案的公司。 SONIX 一直致力于技术革新，提供给客户最的声学检测技术。SONIX 设备被广泛应用于各种材料的无损检测，包括半导体，汽车零件和其他*元......

详细介绍

超声波扫描显微镜被广泛应用于半导体以及集成电路的制造和封装测试行业，是一种理想的无损检测仪器，能够有效地检测器件或材料内部的开裂、气泡、杂质、断层等缺陷。

其主要工作原理是，通过压电陶瓷将电信号转换成超声波（>20KHz），用超声波对样品内部进行高精度地扫描，根据超声波在不同密度材料中的传播速度和反射系数的差异，获得样品内部不同区域的超声波透射或反射，再经由软件算法处理和成像。SAM的核心构成为，电气部件、机械装置、声学部件、软件系统。

SONIX ECHO VS™ 是专为更高精度要求，更复杂元器件设计的新一代设备。
广泛应用在 Flip chips，Stacked die，Bumped die，Bonded wafers 等。

● 高分辨率下，扫描速度是传统超声波扫描显微镜的2.5倍
● 的波形模拟器(Waveform Simulator)及波束仿真(Beam Emulator)
● 扫描分辨率小于1微米
● 水温控制系统及紫外杀菌系统超高频状态工作下，信号更稳定

Product Details:

To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.

Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.
Image Enhancement Suite with heated water, waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
Waveform averaging for improved signal-to-noise ratio
Transducers from 15MHz through 300MHz, designed and matched in-house to address all types of applications and materials
Stacked Die Imaging (SDI) (optional)
Molded Flip Chip Imaging (MFCI)