The TDM–Compact is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control.

   TDM is a patented tool for warpage analysis under a temperature profile. TDM uses the fringe projection technology (also called projection moiré) for non-contact, full-field acquisition of 3D topographies with a resolution as low as 0.5 μm. TDM-Compact acquires a full, absolute 3D cartography of devices with dimensions up to 310 mm x 230 mm (field of view up to 150 mm x 150 mm). Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test. The integrated software package provides tools for representation of the results as 3D plots, vectors diagrams, isometrics views and 2D profiles following user-defined profile lines (e.g., diagonal plots).