FOX-XP 逻辑/存储器/光子器件的高功率测试和可靠性验证解决方案 AEHR老化失效测试系统-上海河畔信息科技有限公司手机版

产品简介

批量生产的高吞吐量可靠性验证和测试系统处理完整的晶圆/面板/单个管芯/模块以实现的生产量在最终封装集成之前确定逻辑/存储器/光子管芯的失效高功率系统，带有多达18个刀片（插槽），用于使用WaferPakTM进行晶圆或面板测试接触器或9个刀片功能，用于单个芯片/模块DiePak®载体可配置的频道资源每个刀片服务器（插槽）有多个资源模块：通用通道模块，高压通道模块或大电流通道模块每个刀片具有多达2......

详细介绍

Full Wafer & Singulated Die / Module Test System

SYSTEM BENEFITS

High Throughput Reliability Verification and Test System for Volume Production

Handles full wafers / panels / singulated die / modules for highest production throughput

Identifies failing logic / memory / photonic die before final package integration

High power system with up to 18 Blades (slots) for wafer or panel testing using WaferPakTM

contactors or 9 Blade capability for singulated die / module DiePak® carriers

Configurable Channel Resources

Multiple resource modules available per Blade (slot): Universal Channel Modules, High Voltage Channel Modules or High Current Channel Modules

Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep scan, pattern data and capture memory per channel for test of devices with BIST/DFT

Up to 1,024 high voltage (29V) or high current (2A) sources resources per Blade

Production Proven Full-Wafer Reliability Verification & Test Solution

Reduces test costs by functionally testing wafers/die/modules during reliability verification

Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer

Aligner / DiePak Loader

Protects devices with individual per channel over-current and over-voltage protection