SYSTEM BENEFITS
Compact Flexible Solution for High Throughput Reliability Verification and Test
Handles full wafer, panel, singulated die and module applications
Identifies failing logic, memory and photonic die before final package integration
High power thermal chuck dual Blade (slot) capability using WaferPakTM contactors or DiePak®
carriers (for singulated die and modules)
Cost-Effective Solution for High Power Wafer/Die/Module Verification and Test
Configurable channel resources per Blade: Universal Channel Modules, High Voltage Channel
Modules or High Current Channel Modules
Up to 2,048 “Universal Channel” resources: (I/O, Clock, PPMU or DPS) per Blade with deep
scan, pattern data and capture memory for testing of devices with BIST or DFT capabilities
Up to 1,024 high voltage (29 V) or high current (2 A) sources resources per Blade
Production Proven Full-Wafer Reliability Verification & Test Solution
Reduces test costs by functionally testing wafers, die or modules during reliability verification
Offers a total solution when configured with a WaferPak contactor, DiePak carrier, Wafer
Aligner and DiePak Loader
Protects devices with individual per channel over-current and over-voltage protection
