SWaP（小型化、轻量化和低功耗）

Small volume, low   weight and low power consumption for demanding applications

触发

External trigger   for signal synchronization - additional trigger via CL possible

14 bit图像

Digitization: The   camera uses a 14 bit ADC

高速

High line rate   imaging at more than 40000 lines per second

高动态范围

High dynamic   range mode available

Array type

InGaAs

Resolution

512 x 1

Pixel size

25 μm x 25 μm

25 μm x 250 μm

Spectral band

0.9 μm to 1.7 μm

Peak Quantum Efficiency (QE)

≈ 80 % @ 1.6 μm

Pixel operability

100 %

Array length

12.8 mm

Array cooling

Uncooled

Dark current

3 x 10⁶ e-/s

3 x 10⁷e-/s

Imaging performance

Maximum line rate

40 kHz

Pixel rate

25 MPixels/sec

Exposure time range

Full flexibility in settings from 3 μs to several   seconds

CDS

Correlated Double Sampling

Gain settings

Various settings from 30 fF (HS) till 2130 fF (HDR)

Pixel well depth

from 450 Ke- (HS) till 32 Me- (HDR)

Gain

From 8 e-/ADU count (HS) till 580 e-/ADU count (HDR)

Dynamic range

From 280:1 (HS) till 2600:1 (HDR)

ADC

14 bit

On-board image processing

Configurable single Non-Uniformity Correction (NUC)   with intelligent bad pixel replacement; user adjustable fixed offset and gain   control

Interfaces

Optical interface

C-mount

U-mount (optional)

Camera control

CameraLink

Xeneth API/SDK

Image acquisition

Integrate While Read (IWR) / Integrate Then Read (ITR);   Snapshot acquisition

Trigger

Trigger in and/or out; LVCMOS

Operating mode

Stand-alone or PC-controlled

Power requirements

Power consumption

+/- 2.6 W

Power supply

12 V

Physical characteristics

Ambient operating temperature range

-40oC to 70oC (industrial components)

Storage temperature range

-50oC to 85oC (industrial components)

Dimensions (W x H x L mm?)

49 x 49 x 53

Weight camera head

< 153 g