Wire Bonder打线-上海衡鹏企业发展有限公司手机版

详细介绍

Wire Bonder概要：

High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability

Wire Bonder特点：

Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2 mm)

with completely updated X, Y and Z motors

Bonding accuracy of±3.0μm（3σ）achieved

Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm

Simultaneous detection and bonding capability in X and Y directions

Wire Bonder规格参数：

Product Name	Wire Bonder
Model	UTC-5100
Bonding Accuracy	±3.0 μm (3 σ), (The bonding accuracy changes depending on the conditions of device and temperature)
Bonding Speed	42 ms/0.7 mm wire (45 ms/2 mm wire) (with loop control and force detection mode) Using Shinkawa standard device
Bonding Wire Length	4 mm maximum (Varies depending on device conditions)
Resolution	XY table: 0.1 μm, Z-axis: 0.1 μm
Vibration Control	Shinkawa NRS - Non Reaction Servo System
Bonding Area	X: 66mm - Camera offset,　Y: 95mm - Camera offset
Wire Size	φ18–50 μm
Bonding Force	3–1,000 gf
No. of Bonding Wires	12,000 wires maximum
Loader / Unloader	Fully automatic magazine stacker system (Option: stocker system)
Workpiece Size	Width 20–102 mm
	Length 95–300 mm
	Thickness0.1 - 0.5 mm (Varies depending on type of device) (Conversion parts are required when thickness changes)
Production Management	Management of equipment availability through production management monitoring screen
Option Available	Communication interface　SECS-I/SECS-II, HSMS, GEM
Utilities	Input Power SupplySingle Phase 100VAC (±5% input variation)　50/60Hz (other voltages require transformer)
	Power ConsumptionApprox.1.2kVA (1.1kW)
	CDA500kPa (5 kgf/cm2) 102L/min
	Vacuum-74kPa (-550 mmHg) or below (gauge)
Physical Dimensions and Mass	1,222W × 964D × 2,087H mm Approx. 520kg