High-productivity and space-saving footprint by adopting twin-head

High-speed thin die pick-up system with a speed of 400ms / t:20um(option) 

*Depending on material conditions

Friction-free bonding head with simultaneous positional and force control for thin die stacked devices

Equipped with die back-side camera on each bonding head, 

enhancing inspection function with a total of 8 cameras

Capable of handling large substrates up to 120mm width x 300mm length

Model

SPA-1000

Bonding Method

DAF bonding

Accuracy             

XY：±5μm (3σ)、θ：±0.05°(3σ) (Machine accuracy excluding material-induced factors)

Productivity

The productivity increased by 2.5 times compared with conventional model.

(Theoretical value with Shinkawa's standard sample)

Chip Size

□0.8 – 25mm

Wafer Size

Maximum 12-inch

Substrate/Leadframe Size

Width 40 – 120mm

Length 180 – 300mm

Thickness0.05 – 0.8mm

Options Available

Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT)

Utilities

Input Power Supply：Single Phase AC200V±5%　50/60Hz (Other power supply options available on request)

Consumption

Vacuum：Below -74kPa (-550mmHg) (gage)

Approx. 2,280W × 1,510D × 1,670H mm　Approx. 2,300 kg

(excludes monitor display and signal tower)