Plasma SystemNORDSON MARCH AP-600-上海衡鹏企业发展有限公司手机版

详细介绍

Nordson AP-600 Plasma System Features：

Touch screen control and graphical user interface give real-time process information

Flexible shelf architecture allows processing of a wide variety of piece parts, components or carriers

13.56 MHz RF generator with automatic matching network delivers excellent process repeatability

Convenient facility hook-ups for periodic calibration requirements used in validation processes

Nordson AP-600 Plasma System Benefits：

State-of-the-art plasma treatment in a compact, bench-top configuration

The AP-600 system from Nordson MARCH is designed to deliver exceptionally uniform plasma cleaning and treatment with unmatched ease of operation, reliability and low cost.

The AP-600 system is completely self-contained, requiring minimal bench space. The system chassis houses the plasma chamber, control electronics, 13.56MHz RF generator, and the automatic matching network (only the vacuum pump is external to the system). Maintenance access is provided through an interlocked door or removable panels.

The plasma chamber is constructed of high-quality aluminum with aluminum fixtures for superior durability. The plasma chamber supports up to 7 removable and adjustable powered or grounded shelves to accommodate a wide range of piece-parts, components, and part carriers including magazines, trays, and boats.

Plasma cleaning, surface activation and adhesion improvement

The AP-600 system is suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices.

The AP-600 system can accommodate a wide range of process gases including argon, oxygen, hydrogen, helium, and fluorinated gases. The system comes standard with two electronic mass flow controllers for optimal gas control, with another two available optionally (four total max.).

Nordson AP-600 Plasma System Specifications：

Enclosure Dimensions	W x D x H – Footprint	569W x 869D x 704H mm (22W x 34D x 28H in.)
	Net Weight	221 kg (487 lbs)
	Equipment Clearance	Right, Left, Front -569 mm (22 in.), Back – 254 mm (10 in.)
Chamber	Maximum Volume	50.4 liters (3076 in³)
	Variable Electrode Configurations	Power-Ground, Ground-Power, Power-Power
	Number of Electrode Positions	7
	Electrode Pitch	25.4 mm (1 in.)
Electrodes	Powered Working Area	330W x 330D mm (13W x 13D in.)
	Ground/Perforated Working Area	368W x 330D mm (14.5W x 13D in.)
	Floating Working Area	330W x 330D mm (13W x 13D in.)
RF Power	Standard Wattage	600 W
RF Power	Frequency	13.56 MHz
Gas Control	Available Flow Volumes	10, 25, 50, 100, 250 or 500 sccm
Gas Control	Maximum Number of MFCs	4
Control &Interface	Software Control	PLC Control with Touch Screen Interface
Control &Interface	Remote Interface	PlasmaLINK, ProcessLINK
Vacuum Pump	Standard Wet Pump	19.5 cfm with Oxygen Oil Mist Eliminator
	Optional Wet Pump	19.5 cfm with Corrosive Oil Mist Eliminator
	Optional Purged Dry Pump	22 cfm
	N2 Purged Pump Flow	2 slm
Facilities	Power Supply	110 VAC, 20A, 50/60 Hz, Single Phase, 12 AWG, 3-Wire or 220 VAC, 10A, 50/60 Hz, Single Phase, 12 AWG, 3-Wire
	Process Gas Fitting Size & Type	6.35 mm (0.25 in.) OD Swagelok Tube
	Process Gas Purity	Lab or Electronic Grade
	Process Gas Pressure	0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated
	Purge Gas Fitting Size & Type	6.35 mm (0.25 in.) OD Swagelok Tube
	Purge Gas Purity	Lab or Electronic Grade N2/CDA
	Purge Gas Pressure	2 bar (30 psig) min. to 6.9 bar (100 psig) max., regulated
	Pneumatic Valves Fitting Size & Type	6.35 mm (0.25 in.) OD Swagelok Tube
	Pneumatic Gas Purity	CDA, Oil Free, Dewpoint ≤7°C(45°F), Particulate Size<5 µm
	Pneumatic Gas Pressure	3.45 bar (50 psig) min. to 6.89 bar (100 psig) max.,regulated
	Exhaust	38 mm (1.5 in.) OD Pipe Flange
Compliance	SEMI	S2/S8 (EH&S/Ergonomics)
Compliance	International	CE Marked
Ancillary Equipment	Gas Generators	Nitrogen, Hydrogen (Requires Additional Non-Optional Hardware)
Ancillary Equipment	Facilities	Chiller, Scrubber

产品简介

详细介绍