产品简介
This ICPCVD process module is designed to produce high quality films at low growth temperatures, enabled through high-density remote plasmas that achieves superior film quality with low substrate dama......
详细信息
- 在低温度下沉积低损伤的薄膜
- 可沉积的典型材料包括: SiO2、Si3N4 、 SiON、Si 和 SiC,衬底温度可低至5ºC
- 65mm、180mm、300mm 尺寸的ICP源 提供了工艺的均匀性
- 晶圆尺寸高至200mm
- 电极的温度范围为5ºC至400ºC
- 已获得ICPCVD气体配送技术
- 实时监测清洗工艺, 并且可自动停止工艺
SiO2 deposited using TEOS and O2 by ICP CVD in ~50μm deep trench 4:1 aspect ratio
SiNx deposited by ICP CVD at room temperature for 22nm T-gate HEMT