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美国NDT BondHub Bond Testing C-scan

具体成交价以合同协议为准

2022-06-30深圳市
型号
三信亚太科技(深圳)有限公司

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产品简介
美国NDT BondHub Bond Testing C-scan
详细信息
Physical / CaseWeight25lb (11kg)
 Dimensions (W x H x D)7.5in. x 18.0in. x 14.0in. (191mm x 457mm x 356mm)
 Operating Temperature15 °F to 158 °F (-10 °C to 70 °C)
 Case ConstructionIntegrated in Pelican Style case, vibration isolation
 Connector typeUSB, DVI, Multi-pin scanner connector
PCProcessor1GHz
 HDD128GB Solid state
 Operating SystemWindows 7
 PeripheralsMini-keyboard with trackpad and separate mouse
 Display typeColor TFT LCD sun readable 1200nit
 Display size800 x 600 pixels, 12.1in. (307mm) diagonal
OperationalModesResonance
  Pitch-Catch
  MIA (Mechanical Impedance Analysis)
 Freq range250Hz to 1.5MHz
 Display ModesC-scan- Phase, Magnitude or Additive view
  Impedance plane (flying dot)= direct representation of bond tester screen
  Strip chart- rectangular real-time streaming of outputs
 Display AnalysisRetrace position of all dots acquired
  Flaw sizing- length, area
  Changeable gates in post-processing, Save scan plans, user setups etc.
  Auto and user defined scaling, mm/inch units, move scanner to position
 Image Output formatBMP
 Gates/ AlarmsBox, ring, sectorial individually sizable gates. LED and audible alarms
Power SourcePower SourceTwo Li-Ion batteries or AC charger (110-240V)
 Battery life4-5 hours
CertificationCertificationFactory Calibration
WarrantyWarranty1 year
CompatibilityBond TestersBondascope 3100
  Other Manufacturer's bond testers
 ScannersManual Scanners: StringScan, SlideScan
  Automatic Scanners: CrosScan, TunnelScan

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